HS编码848690,品目8486的零件及附件从中国出口到新西兰,需要在新西兰缴纳的进口税费查询
| HS Code | 英文描述 | 关税信息 |
|---|---|---|
| 8486.90.07.00E | Of apparatus for the projection or drawing of circuit patterns and other photographic apparatus | |
| 8486.90.13.00E | Parts of centrifuges, including centrifugal dryers | |
| 8486.90.17.00L | Of drawing, marking-out or mathematical calculating instruments | |
| 8486.90.23.00L | Of automated electronic component placement machines of a kind used solely or principally for the manufacture of printed circuit assemblies | |
| 8486.90.27.00F | Of automated machines for the transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices | |
| 8486.90.37.00A | Other | |
| 8486.90.47.00G | Parts of machines and apparatus for soldering, brazing or welding; of machines and apparatus for hot spraying of metals or cermets | |
| 8486.90.53.00G | Of furnaces and ovens | |
| 8486.90.59.00E | Other | |
| 8486.90.61.00K | Dies for extruding plastics | |
| 8486.90.63.00B | Of plastic injection and blow moulding machines | |
| 8486.90.67.00H | Other | |
| 8486.90.68.00D | Of tool holders and self-opening die heads; work holders; dividing heads and other special attachments for machine-tools; parts suitable for use solely or principally with the machines of headings 84.64 or 84.65 | |
| 8486.90.69.00L | Parts of machines for working any material by removal of material, by laser or other light or photon beam in the production of semiconductor wafers | |
| 8486.90.72.00A | Other | |
| 8486.90.73.00H | Of microscopes; of diffraction apparatus | |
| 8486.90.74.00D | Parts of apparatus for wet etching, developing stripping or cleaning semiconductor wafers and flat panel displays | |
| 8486.90.76.00G | Other | |
| 8486.90.77.00C | Of particle accelerators | |
| 8486.90.79.00F | Other | |
| 8486.90.81.00L | Parts of apparatus for physical deposition by sputtering on semiconductor wafers, and for semiconductor production | |
| 8486.90.82.00G | Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors | |
| 8486.90.83.00C | Parts for spinners for coating photographic emulsions on semiconductor wafers | |
| 8486.90.84.00K | Parts of apparatus for growing or pulling monocrystal semiconductor boules | |
| 8486.90.85.00F | Parts of apparatus for dry etching, developing, stripping or cleaning semiconductor wafers and flat panel displays | |
| 8486.90.86.00B | Parts of encapsulation equipment for assembly of semiconductors | |
| 8486.90.87.00J | Parts of epitaxial deposition machines for semiconductor wafers | |
| 8486.90.88.00E | Parts of machines for bending, folding and straightening semiconductor leads | |
| 8486.90.89.00A | Parts of electro-mechanical hand tools for working in the hand | |
| 8486.90.91.00F | Accessories suitable for use solely or principally with the machines of headings 84.64 and 84.65 | |
| 8486.90.92.00B | Parts of self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers | |
| 8486.90.93.00J | Parts of ion implanters for doping semiconductor materials | |
| 8486.90.94.00E | Printed circuit assemblies | |
| 8486.90.99.00G | Other | |
| 8486.90.07.00E | Of apparatus for the projection or drawing of circuit patterns and other photographic apparatus | |
| 8486.90.13.00E | Parts of centrifuges, including centrifugal dryers | |
| 8486.90.17.00L | Of drawing, marking-out or mathematical calculating instruments | |
| 8486.90.23.00L | Of automated electronic component placement machines of a kind used solely or principally for the manufacture of printed circuit assemblies | |
| 8486.90.27.00F | Of automated machines for the transport, handling and storage of semiconductor wafers, wafer cassettes, wafer boxes and other material for semiconductor devices | |
| 8486.90.37.00A | Other | |
| 8486.90.47.00G | Parts of machines and apparatus for soldering, brazing or welding; of machines and apparatus for hot spraying of metals or cermets | |
| 8486.90.53.00G | Of furnaces and ovens | |
| 8486.90.59.00E | Other | |
| 8486.90.61.00K | Dies for extruding plastics | |
| 8486.90.63.00B | Of plastic injection and blow moulding machines | |
| 8486.90.67.00H | Other | |
| 8486.90.68.00D | Of tool holders and self-opening die heads; work holders; dividing heads and other special attachments for machine-tools; parts suitable for use solely or principally with the machines of headings 84.64 or 84.65 | |
| 8486.90.69.00L | Parts of machines for working any material by removal of material, by laser or other light or photon beam in the production of semiconductor wafers | |
| 8486.90.72.00A | Other | |
| 8486.90.73.00H | Of microscopes; of diffraction apparatus | |
| 8486.90.74.00D | Parts of apparatus for wet etching, developing stripping or cleaning semiconductor wafers and flat panel displays | |
| 8486.90.76.00G | Other | |
| 8486.90.77.00C | Of particle accelerators | |
| 8486.90.79.00F | Other | |
| 8486.90.81.00L | Parts of apparatus for physical deposition by sputtering on semiconductor wafers, and for semiconductor production | |
| 8486.90.82.00G | Parts for die attach apparatus, tape automated bonders, and wire bonders for assembly of semiconductors | |
| 8486.90.83.00C | Parts for spinners for coating photographic emulsions on semiconductor wafers | |
| 8486.90.84.00K | Parts of apparatus for growing or pulling monocrystal semiconductor boules | |
| 8486.90.85.00F | Parts of apparatus for dry etching, developing, stripping or cleaning semiconductor wafers and flat panel displays | |
| 8486.90.86.00B | Parts of encapsulation equipment for assembly of semiconductors | |
| 8486.90.87.00J | Parts of epitaxial deposition machines for semiconductor wafers | |
| 8486.90.88.00E | Parts of machines for bending, folding and straightening semiconductor leads | |
| 8486.90.89.00A | Parts of electro-mechanical hand tools for working in the hand | |
| 8486.90.91.00F | Accessories suitable for use solely or principally with the machines of headings 84.64 and 84.65 | |
| 8486.90.92.00B | Parts of self-adhesive circular polishing pads of a kind used for the manufacture of semiconductor wafers | |
| 8486.90.93.00J | Parts of ion implanters for doping semiconductor materials | |
| 8486.90.94.00E | Printed circuit assemblies | |
| 8486.90.99.00G | Other |
税费概览：
【概览】
无论个人或商业实体在新西兰从事商品进口，均须缴纳进口关税和其他税费。进口税费全部以货运价值，即到岸价格（CIF)计算。同时，进口商品还须征收增值税、入境交易费、入境货物交易税，某些商品征收消费税。
【关税】
新西兰关税税率在0%和15%之间，平均税率为5.11%。某些商品免征关税，如书籍、笔记本电脑和其他电子产品。
【增值税】
增值税=标准增值税税率15%×（CIF价+适用关税+消费税）。
【起征点】
进口商品关税、增值税总额不超过60新西兰元，免征增值税、关税和其他进口税费。
【其他】
入境交易费：前提是进口商品增值税、关税总和超过60新西兰元，才可征收入境交易费。29.26新西兰元的入境交易费（包括增值税）=商品入境清关费+商品进口报关费。基础工业生物安全体系部针对每一批进口入境的产品征收17.63新西兰元（包括增值税）=入境交易费+海关收取的相应费用。 联合费（包括增值税）为46.89新西兰元。 消费税是针对汽油、烟酒制品征收的税费。
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